2023 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors


An ECI Conference Series

May 15-18, 2023
Sapporo, Hokkaido, Japan

About the Conference

The ULSIC vs. TFT conference is organized to provide a forum for the discussion on the latest scientific development in two of the most critical high-tech fields, i.e., Ultra Large Scale Integrated Circuits (ULSICs) and Thin Film Transistors (TFTs). It aims to exchange state-of-the-art information among those involved in the research, development, and production. This conference will bring together global experts to exchange opinions on common scientific issues.

The 2023 conference is a continuation of the previous seven successful conferences held in Barga, Italy (2007), Xi’an, China (2009), Hong Kong, China (2011), Grenoble, France (2013), Lake  Tahoe, USA (2015), Hernstein, Austria (2017), and Kyoto, Japan (2019). These conferences were attended by worldwide experts and leaders (national academy members, presidents of prestigious universities, presidents and VPs of semiconductor companies, professors, researchers, engineers, etc.) from universities, industry, and national laboratories of more than 20 countries. The maximum number of attendees is limited to 100.

To focus the discussion, we choose some of the most critical challenges on materials, fabrication processes, devices, and applications to discuss. The meeting format is shown below. 

  • Each day is composed of oral presentations mostly by invited speakers in the morning and free discussions in the afternoon.
  • A panel discussion session is held each evening to exchange opinions on the big picture of technology development.
  • All attendees will attend the presentations and panels, live, and eat in the same hotel throughout the conference. A Poster Session will be scheduled for students and postdoctoral candidates.

In addition to the Abstract brochure, full manuscripts will be published as a special issue of the ECS Transactions which will be available at the meeting time. The conference sponsor ECI (Engineering Conferences International) is a not-for-profit global engineering conferences program, originally established in 1962, that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines. In addition to Electrochemical Society Electronics and Photonics Division, the technical sponsors in contact are JSAP (Japan Society of Applied Physics), KPS (Korean Physical Society) Semiconductor Division, and others.

Technical Program

  • ULSIC vs. TFT
  • Device Physics, Modelling, and Reliability
  • Semiconductors, Dielectrics, and Interconnect Materials
  • Advanced Processes and Production Issues
  • Novel Applications
  • Panel Discussions on Selective Topics
  • Poster Presentations

Conference Organization

Chair: Yue. Kuo, Texas A&M University

Scientific Advisory Committee:
O. Bonnaud, University Rennes 1 and GIP-CNFM
S. De Gendt, IMEC
A. Flewitt, University of Cambridge
H. Hosono, Tokyo Institute of Technology
C. S. Hwang, Seoul National University
J. Jang, Kyung Hee University
P.-T. Liu, National Yang Ming Chiao Tung University
P. Mascher, McMaster University
J. Murota, Tohoku University
A. Nathan, University of Cambridge
K. Nomura, University of California, San Diego
M. Shur, Rensselaer Polytechnic Institute
Y. Uraoka, Nara Institute of Science and Technology

Call for Abstracts

Original papers for oral and poster presentations are encouraged. Those who wish to be considered for an oral or poster presentation should submit a one-page (extended) abstract online.

Oral Abstract Submission Deadline:               January 15, 2023
Poster Abstract Submission Deadline:            January 31, 2023

All abstracts should be submitted electronically HERE.

Please prepare your abstract according to this template: docx or doc.

Abstracts of all presentations will be made available to conference participants prior to the start of the conference.

Note: Only a limited number of oral presentation slots are available and thus all submissions for oral sessions will be considered for both oral and poster presentation.

Full Manuscript for ECS Transactions Due 03/15/2023, website will be announced.

Venue Information

Technical Co-Sponsors

ECS Electronics and Photonics Division
Others to be announced

General Information About ECI

Engineering Conferences International (ECI) is a not-for-profit, global engineering conferences program, originally established in 1962 that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines.

The format of the conference provides morning and late afternoon or evening sessions in which major presentations are made. Poster sessions will be scheduled for evening discussion as well. Available time is included during the afternoons for ad hoc meetings, informal discussions, and/or recreation. This format is designed to enhance rapport among participants and promote dialogue on the development of the meeting. We believe the conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums.

All participants are expected both to attend the entire conference and to contribute actively to the discussions. The recording/photographing of lectures and presentations is forbidden. As ECI conferences take place in an informal atmosphere, casual clothing is the usual attire.

Smoking is prohibited at ECI conferences and conference functions.

  • Participant Login

    To sign in as a participant, please visit our registration portal.
  • Add Email

    To ensure receipt of ECI mailings, please add 'eci@informz.net' to your address book.
  • Page Sections