2022 Conferences
October 2-7, 2022
NANOMECHANICAL TESTING IN MATERIALS RESEARCH AND DEVELOPMENT VIII — 21AN
S. Korte-Kerzel, RWTH Aachen University
Split, Croatia
Oct. 30 – Nov. 3, 2022
ELECTROPHORETIC DEPOSITION VII: FUNDAMENTALS AND APPLICATIONS — 20AE
A.R. Boccaccini, Univ. of Erlangen-Nuremberg; B. Ferrari, Spanish Research Council; A.J. Pascall, Brookhaven National Laboratory; T. Uchikoshi, National Institute for Materials Science
Santa Fe, New Mexico
November 13-18, 2022
CERAMIC MATRIX COMPOSITES II: SCIENCE AND TECHNOLOGY OF MATERIALS, DESIGN, APPLICATIONS, PERFORMANCE AND INTEGRATION — 21AS
Y. Kagawa, Tokyo University of Technology; R. Darolia, GE Aviation; R. Raj, University of Colorado; D. Koch, University of Augsburg; G. Vignoles, University of Bordeaux; J. Binner, University of Birmingham
Santa Fe, New Mexico
2023 Conferences
March 19 – 24, 2023
ENERGY EFFICIENCY AND OTHER ATTRIBUTES OF CURRENT INFUSED PROCESSING: SPS AND FLASH — 22AD
R. Raj, University of Colorado at Boulder
Tomar, Portugal
May 28 – June 2, 2023
ALKALI ACTIVATED MATERIALS AND GEOPOLYMERS: SUSTAINABLE CONSTRUCTION MATERIALS AND CERAMICS MADE UNDER AMBIENT CONDITIONS — 21AG
W.M. Kriven, University of Illinois at Urbana-Champaign; C. Leonelli, Universita’ degli Studi di Modena e Reggio Emilia; J.L. Provis, University of Sheffield; A.R. Boccaccini, University of Erlangen-Nuremberg
Cetraro (Calabria), Italy
July 16-21, 2023
SIXTH INTERNATIONAL WORKSHOP ON STRESS-ASSISTED CORROSION DAMAGE — 21AV
A.K. Vasudevan, Office of Naval Research (retired); R. Latanision, Exponent, Inc.; H. Holroyd, Luxfer (retired); F. Friedersdorf, Luna Innovations Incorporated
Washington, DC area
Summer, 2023 (TBA)
SYNTACTIC AND COMPOSITE FOAMS VI — 20AF
G.M. Gladysz and K.K. Chawla, University of Alabama at Birmingham; A. R. Boccaccini, University of Erlangen-Nuremberg; M. Fukushima, National Institute of Advanced Industrial Science and Technology
Riga, Latvia
November 2023 TBA
NONSTOICHIOMETRIC COMPOUNDS VIII — 20AO
W. Chueh, Stanford University; F-Z Fung, National Cheng Kung University; R. Waser, RWTH Aachen; H. Takamura, Tohoku University
Tainan, Taiwan