Ultra-High Temperature Ceramics: Materials for Extreme Environment Applications V

An ECI Conference Series

POSTPONED

Our apologies, but given the COVID-19 pandemic, we have rescheduled the conference to June 6-9, 2021. All registrations and conference fees will be carried forward.

If you made a pre or post conference registration at the Snowbird Resort, please contact them directly to cancel.

Sincerely, UHTC Conference Chairs

Carmen Carney, Air Force Research Laboratory; Materials and Manufacturing Directorate

Carolina Tallon, Virginia Tech; Department of Materials Science and Engineering,

Gregory Thompson, University of Alabama; Department of Metallurgical & Materials Engineering

Chris Weinberger, Colorado State University Department of Mechanical Engineering

Daniel Butts, MACH-20, LLC.

and
Ram Darolia, ECI Technical Liaison
Barbara Hickernell, ECI Executive Director

June 6-9, 2021
Snowbird, Utah

The Cliff Lodge

Abstract Submission
(TBA)

About This Conference

Ultra-High Temperature Ceramics are a family of compounds that display a unique set of properties, including extremely high melting temperatures (>3000°C), high hardness and good chemical stability and strength at high temperatures.  UHTC materials are typically considered to be the carbides, nitrides, and borides of the transition metals, but the Group IV compounds (Ti, Zr, Hf) plus TaC are generally considered to be the main focus of research due to the superior melting temperatures and stable high-melting temperature oxide that forms in situ. The combination of properties make these materials potential candidates for a variety of high-temperature structural applications, including engines, high-speed vehicles, plasma arc electrodes, advanced nuclear fuels, fusion first walls and divertors, cutting tools, furnace elements and high temperature shielding.

The development of structural materials for use in oxidizing and rapid heating environments at temperatures above 1600°C is therefore of great engineering importance. For the past two decades researchers have built on a resurgence in exploration of UHTCs and have expanded the scope of engineering and design using these novel materials.  Topics such as incorporating UHTCs in fiber reinforced composites; investigating unique high entropy carbides and borides, and expanding the field of MAX phases have all led to new developments. The purpose of this meeting is to thus bring together interested parties from academia, government and industry in a single forum that allows the bench researchers to interact with designers and engineers to discuss state-of-the-art research and development efforts, what the results mean in a broader context and how to move the technology forward toward near-term and longer term use.

Outline

Interest in high temperature ceramic phases has been growing in recent years, with significant ongoing research programmes in many countries across the world. This has occurred because the conditions in which materials are required to operate are becoming ever more challenging as operating temperatures and pressures are increasing in all areas of manufacture, energy generation, transport and environmental clean-up. Often extreme temperatures are combined with severe chemical environments and exposure to high energy and, in the nuclear industry, to ionizing radiation. The production and processing of next-generation materials capable of operating in these conditions is non-trivial, especially at the scale required in many of these applications. In some cases, totally new compositions, processing and joining strategies have to be developed. The need for long-term reliability in many components means that defects introduced during processing will need to be kept to an absolute minimum or defect-tolerant systems developed, e.g. via fiber reinforcement. Modelling techniques that link different length and time scales to define the materials chemistry, microstructure and processing strategy are key to speeding up the development of these next-generation materials. Further, they will not function in isolation but as part of a system. It is the behaviour of the latter that is crucial, so that interactions between different materials, the joining processes, the behaviour of the different parts under extreme conditions and how they can be made to work together, must be understood.

This conference seeks to bring together the entire community – processing and oxidation bench scientists, designers, engineers and users of these materials under one roof to present on and discuss emerging and state of the art UHTC processing, evaluation, and implementation techniques.

This conference is the fifth of a regular series of meetings held every two to three years. The vision for this workshop is to have 5 main topic areas:

  • Processing (including all processing steps, scale up issues and novel approaches);
  • Environmental response (including thermodynamic considerations, oxidation behaviour, etc);
  • Characterization (including thermomechanical properties, subscale testing, etc);
  • Modelling (at all levels, from atomistic to processing and property related); and
  • Applications (including high-speed flight, propulsion, and energy related).

As with the previous conferences, the bulk of the work is likely to be focused on processing and characterisation studies, as these materials are the subject of numerous fundamental research programs, but it is important to encourage cross-fertilization with modellers and application driven activities ongoing within the testing and design communities, as well as bringing in the “bigger picture” systems-level engineers and managers to introduce them to the capabilities of the materials and share with the researchers their needs.

Conference Organization

Conference Chair & Co-Chairs

Dr. Daniel Butts
MACH-20, LLC
Tel: 1-256-251-7275

Dr. Carmen Carney
Air Force Research Laboratory; Materials and Manufacturing Directorate
Tel: +1-937-255-9154

Dr. Carolina Tallon
Virginia Tech; Department of Materials Science and Engineering,
Tel: +1-540-231-2506

Dr. Gregory Thompson
University of Alabama; Department of Metallurgical & Materials Engineering
Tel: +1-205-348-1589

Dr. Chris Weinberger
Colorado State University Department of Mechanical Engineering
Tel: +1-970-491-1625

Organizing Committee

Dr. Jon Binner (Birmingham University, UK)
Dr. Michael Cinibulk (Air Force Research Lab, USA)
Dr. William Fahrenholtz (Missouri University of Science & Technology, USA)
Dr. Frederic Monteverde (Institute of Science and Technology for Ceramics ISTEC, Italy)
Dr. Elizabeth Opila (University of Virginia, USA)
Dr. Diletta Sciti (Institute of Science and Technology for Ceramics ISTEC, Italy)
Dr. Eric Wuchina (Naval Surface Warfare Center, USA)
Dr. Yanchun Zhou (Aerospace Research Institute of Materials & Processing Technology, China)

Confirmed Invited Speakers

Jon Binner (University of Birmingham, UK)
William Carter (DARPA, USA)
Michael Cinibulk (Air Force Research Laboratory, USA)
Elizabeth Congdon, Johns Hopkins University Applied Physics Laboratory (JHU/APL)
William Fahrenholtz (Missouri University of Science & Technology, USA)
Douglas Fletcher (University of Vermont, USA)
Greg Hilmas (Missouri University of Science & Technology, USA)
Frederic Monteverde (CNR Istec – Institute of Science and Technology for Ceramics, Italy),  
Elizabeth Opila (University of Virginia, USA) 
Raffaele Savino (University of Naples, Italy) 
Diletta Sciti (CNR Istec – Institute of Science and Technology for Ceramics, Italy)
Yanchun Zhou (Aerospace Research Institute of Materials and Processing Technology of China)

Abstract Submission

Deadline to be announced

Please select a session (and, if you wish, an alternate session) where you believe your work fits best.

  • Processing (including all processing steps, scale up issues and novel approaches);
  • Environmental response (including thermodynamic considerations, oxidation behaviour, etc);
  • Characterization (including thermomechanical properties, subscale testing, etc);
  • Modelling (at all levels, from atomistic to processing and property related); and
  • Applications (including high-speed flight, propulsion, and energy related).

Abstracts (one page maximum) that include specific results and conclusions to allow a scientific assessment of the proposed presentation are invited.  Please prepare your abstract according to this template: docx or doc.

Abstracts must be submitted electronically using the template provided here.

Oral abstract submission deadline:               TBA        

Poster abstract submission deadline:            TBA

Abstracts of all presentations will be made available to conference participants prior to the sof the conference.

Note: Only a limited number of oral presentation slots are available and thus all submissions for oral sessions will be considered for both oral and poster presentation.

Awards will be presented to the top student posters.

Conference Venue

Snowbird Resort is nestled within the Little Cottonwood Canyon, in the Wasatch Range of the Rocky Mountains in the state of Utah. This mountain setting offers excellent meeting facilities, dining, accommodations and activities. Salt Lake International Airport (SLC) is approximately 29 miles away from Snowbird.

Ground transportation options between Salt Lake International Airport and Snowbird include rental car, taxi (approximately $75-$85 one-way), and shuttle service (approximately $45 one-way and $82 round trip) with Canyon Transportation.

Conference participants will be housed in The Cliff Lodge that offers three restaurants, two lounges, two swimming pools, four hot tubs and a world class spa.

Conference Fees

All conference fees are inclusive. They include registration, accommodations (Sunday, Monday, and Tuesday nights), all meals (with a reception instead of dinner on Tuesday), aerial tram ticket and taxes from the reception on Sunday through lunch on Wednesday. Incidental fees (faxes, laundry, etc.) are billed to your personal account by the hotel. 

ALL PARTICIPANTS (INCLUDING MEMBERS OF THE ORGANIZING COMMITTEE AND INVITED SPEAKERS) ARE REQUIRED TO REGISTER.

The conference fees are: 


Register on or before May 1, 2021Register after May 1, 2021
Participant (single occupancy or sharing room with a guest; guest fee additional)US $1,885.00 US $2,085.00 
Participant (sharing a room with another participant)US $1,605.00 US $1,805.00 
Bona fide Graduate Student (sharing a room with another student) (Those in this category must send proof of current status – copy of current Student ID can be faxed to 1-212-514-6030 or emailed to Kathy@engconfintl.org)US $1,270.00 US $1,470.00 
**Fees for Guest/accompanying person sharing bedroom with single occupancy participant. (A guest badge will be issued and this fee Includes all conference meals)
US $495.00 US $495.00 

If you plan to bring children to the conference, please contact ECI (info@engconfintl.org) for pricing.

Conference Registration

You will need a login name and password to register for ECI conferences through our online system. If you have been a recent participant at an ECI conference or have submitted an online application or request for information about an ECI Conference, you may already have an account with us. If you know your login information, please use it. 

If you are not certain if you already have a login and password, please click on automated password retrieval and enter your e-mail address before creating a new account. If we do not have a valid email address on file for you, a pop up window will appear stating that no records were located. Click “OK” and then follow the instructions to create a new account. 

If you have any questions or experience any difficulties, please email kathy@engconfintl.org.

Special Notes and Payment Instructions

We suggest that you register as soon as possible to be certain that you will have a hotel room at the conference rate.  

All participants are encouraged to register before May 1, 2021There is a discounted price for registering before this date.  Hotel space cannot be guaranteed for registrations received after this date.  Your registration is not officially confirmed until we receive payment of the amount due.  ECI reserves the right to cancel your room registration if payment is not received. Your invoice/receipt will automatically be e-mailed upon of receipt of your registration.  Should you need a signed receipt, please contact Kathy Chan (kathy@engconfintl.org).

Because of contractual guarantees made with the hotel for room and meal functions, no shows, late arrivals, missed meals and early departures cannot receive fee adjustments.  If you have a disability and may require accommodation in order to participate fully in this conference, please indicate this when you register. An ECI representative will contact you to discuss your specific needs. If you have special dietary requirements (e.g., vegetarian or a food allergy), please make a note on your registration.  The chef needs to know this information in advance if we are to accommodate you. ECI will attempt to accommodate special requests such as Kosher or Halal meals, but such meals may not be available at all conference sites. The participant must pay any additional costs for special meal requests to ECI.

Payment must be made by credit card (Visa, MasterCard, and Amex), check or money order drawn on a U.S. bank in U.S. dollars, payable to ENGINEERING CONFERENCES INTERNATIONAL. Checks or money orders in any other currencies are NOT ACCEPTABLE.  Payment must be made on the web site except for those who are sending payment by wire transfer or have a purchase order from their company/institution. 

WIRE TRANSFER PAYMENT: If you are planning to make payment by wire transfer, please contact ECI for the bank information. You must add $30 to cover ECI bank charges. Please reference your full name and the conference title.  Either fax a copy of your bank transfer papers to ECI (Fax: +1-212-514-6030) or email a scanned copy to kathy@engconfintl.org. This is very important – otherwise it is extremely difficult to trace your payment and you may not receive a receipt prior to the conference.

Cancellation Policy: Cancellation must be received by ECI in writing at least 28 days prior to the start of the conference in order for a full refund (less a processing fee) to be considered. The ECI auditors require that refunds for all conference cancellations be processed after the conference so that the necessary back-up information (e.g., hotel list of those in-house) can be attached to the refund request and ECI can verify that the hotel has not charged a cancellation fee. 

Cancellation fees:

  • Cancellations received more than 28 days prior to the conference start date are subject to a processing fee of 4% of the total fee, plus any direct expenses incurred by ECI. 
  • Cancellations received 15 – 28 days prior to the conference start date are subject to a $250 cancellation fee plus any direct expenses incurred by ECI. 
  • Cancellations received 8 – 14 days prior to the conference start date are subject to a $500 cancellation fee plus any direct expenses incurred by ECI. 
  • No refunds will be issued for cancellations received less than 7 days prior to the conference start date. 
  • No refunds will be issued due to inclement weather or travel disruptions/cancellations.

Registrations may be transferred without incurring any penalty or cancellation fee.

Denied or delayed visa

If a participant is forced to cancel due to a denied or delayed entry visa, ECI will issue a full refund if ECI has been notified of a potential visa issue at least four weeks prior to the conference start date.

Change of payment method

If an attendee who has already paid the conference fee with a credit card requests that the fee be refunded to that card so that it can be paid in a different manner (e.g., charged to an alternate credit card, or paid via check or bank transfer), a processing fee of 4% of the total fee amount will apply.

Disclaimer

It may be necessary for reasons beyond the control of ECI to alter the content and timing of the program or the identity of the speakers. In the unfortunate circumstance that an event is cancelled, ECI is not liable for any costs incurred by participants in connection with their attendance.

Smoking is prohibited at ECI conferences and conference functions.  

Should you have specific questions regarding your registration, please contact Kathy Chan (Kathy@engconfintl.org). 

Pre and Post Conference Room Reservations

If you plan to extend your stay at the conference hotel please complete and return the following form:

Sponsorship Opportunities

Iridium: $10,000 

  • Company logo and link on event website
  • Company logo included in sponsor slideshow in meeting room
  • Company included on sponsor list in event program
  • Company Ad in event program (full page)

Platinum: $8,000 

  • Company logo and link on event website
  • Company logo included in sponsor slideshow in meeting room
  • Company included on sponsor list in event program
  • Company Ad in event program (full page)

Gold: $6,000 

  • Company logo and link on event website
  • Company logo included in sponsor slideshow in meeting room
  • Company included on sponsor list in event program
  • Company Ad in event program (full page)

Silver: $2,000 

  • Company logo and link on event website
  • Company logo included in sponsor slideshow in meeting room
  • Company included on sponsor list in event program
  • Company Ad in event program (half page)

Bronze: $1,000 

  • Company logo and link on event website
  • Company logo included in sponsor slideshow in meeting room
  • Company included on sponsor list in event program
  • Company Ad in event program (half page)

Student / Young Professional: $1,000+

  • Company logo and link on event website
  • Company logo included in sponsor slideshow in meeting room
  • Company included on sponsor list in event program
  • Company Ad in event program (half page)

Kevin Korpics (kevin@engconfintl.org) (+1-212-514-6760) may be contacted for invoicing and other questions. Please make checks payable to: 

Engineering Conferences International 
Attn: UHTC V 
32 Broadway, Suite 314 
New York, NY 10004 

Payment can also be made via wire transfer or credit card. 

You must reference your company name and the conference title “UHTC V” so the contribution can be identified. Thank you in advance. 

 Please note that none of the sponsor packages include free or discounted registrations for attendees from sponsor companies. Attendees from sponsor companies are required to pay the conference fee as well. 

Graduate Student Support

Limited funding is available to support the attendance of graduate students. Students must submit an abstract for a poster submission, a statement indicating why they want to attend and how it would benefit their studies (one page maximum), and a brief CV. Abstracts and application can be submitted here.

General Information about ECI

Engineering Conferences International (ECI) is a not-for-profit, global engineering conferences program, originally established in 1962 that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines.

The format of the conference provides morning and late afternoon or evening sessions in which major presentations are made. Poster sessions will be scheduled for evening discussion as well. Available time is included during the afternoons for ad hoc meetings, informal discussions, and/or recreation. This format is designed to enhance rapport among participants and promote dialogue on the development of the meeting. We believe the conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums.

All participants are expected both to attend the entire conference and to contribute actively to the discussions. The recording/photographing of lectures and presentations is forbidden. As ECI conferences take place in an informal atmosphere, casual clothing is the usual attire.

Smoking is prohibited at ECI conferences and conference functions.